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Additionally, the specific construction of the PCB in terms of resin content, the types of fiberglass cloth used, and the adhesion and long-term thermochemical compatibility between the resin system and copper which is plated within vias can have a significant impact on longterm reliability. Some of these factors relate to the impact they have on CTEs, both in the z-axis as well as in the x- and y-axes. For example, using a very high resin content prepreg layer adjacent to a very low resin content layer increases the stress at the interface of these layers due to the differences in thermal expansion that result from the differences in resin-to-glass concentrations.The higher temperatures of lead-free assembly result in a greater absolute level of expansion or stress at these interfaces, which can lead to blistering or delamination. The distribution of the glass filaments within the resin system can have a similar effect. Within a given layer or prepreg, if there are resin-rich versus glass-rich areas, the differences in thermal expansion between these areas cause stresses that can lead to delamination, or at the interface with a plated-through hole (PTH) will result in points of stress-strain discontinuity resulting from differences in the z-axis expansion values. It is not uncommon to see cracks in the PTH copper begin at these points and ultimately lead to failure. Section 10.5 discusses the material properties relevant to both surviving lead-free assembly as well as ensuring long-term reliability. Although the test methods used to assess longterm reliability are beyond the scope of this chapter, where relevant, a brief description will be provided to help explain performance differences. However, before discussing these properties in more detail, Section 10.4 presents some of the concerns related to the components used to make base materials. download pdf in mvc 4 The Features Of Using Rotativa To Generate PDF
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