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The common alternatives to HASL, which are growing in use as lead-free assembly is adopted, typically do not involve a bake process or significant thermal cycle Although this is good in terms of the reduced thermal cycling exposure to the base material, it also results in one less opportunity for moisture to be removed from the PCB prior to assembly This should be considered when deciding whether a drying step is needed prior to assembly 1123 PCB Assembly Considerations Although a complete discussion of assembly variables is beyond the scope of this chapter, a few key points need to be outlined with respect to material selection and lead-free assembly variables First, as has been pointed out several times, the storage conditions of the PCB prior to assembly should be examined. birt code 39 BIRT ยป creating barcodes in BIRT Designer - Eclipse Community Forums
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EAN 128 (with one or more application identifiers). Global Trade Item Number ( GTIN) based on EAN 128 . GS1-Databar. GS1-Databar expanded. TABLE 11.2 Drying Recommendations Prior to Assembly Based on Surface Finish Type Final Finish Tin Silver Nickel/Gold Organic Coating Temperature 125 C 150 C 150 C 105 C Time (hr) 4 4 4 2 Comments Higher temperature may reduce solderability Silver may tarnish, but solderability should not be affected No issues arise with extended bake on nickel/gold finish Extended bake cycles may negatively impact multiple heat cycle assembly processes Development of the assembly profile is important not just for the obvious requirements of component assembly, but also to ensure that the PCB is not damaged as a result of the thermal exposures These objectives often compete with each other Profiles vary with PCB thickness, copper distribution, component densities, and other factors Defining these profiles to meet both objectives can be a very complex process But with respect to the impact on the PCB and the base materials, care should be exercised in defining the heat ramp rate, the time the PCB is exposed to the peak temperature, and the cooldown rate Minimizing temperature gradients across the PCB is important in reducing the stresses that arise from thermal expansion. birt code 39 Java Code - 39 Barcodes Generator Guide - BarcodeLib.com
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How to Create & Create Linear and 2D Barcode Images in Eclipse BIRT Report ... Support to create more than 20 barcode types, including QR Code, Code 39 , ... So, armed with a solid understanding of the Fusion message, tools, and the technologies behind Oracle ADF, the next step is to get hands on with JDeveloper and get comfortable with the key features you need for building a Fusion application. Unequal copper distribution across the PCB and differences in component mass across the PCB can lead to hot spots that can approach decomposition temperatures or create areas of stress resulting from thermal expansion differences These hot spots or severe temperature gradients can be exacerbated by trying to speed up the process by setting the reflow oven zone temperatures very high You can reduce these hot spots and thermal gradients by setting up soak profiles where the PCB is allowed to stabilize at specific temperatures before heating to the peak temperature Cooldown rates must also be controlled for similar reasons Cooling too fast can lead to significant temperature gradients and induce thermal expansion related stresses that can result in blisters, delamination, or pad cratering, which is fracturing in the PCB base material that propagates underneath a copper pad on the surface of the PCB. =1 =0 =100 Finally, rework procedures must be examined and controlled more strictly in lead-free applications Control of the rework temperature and time that the PCB is exposed to this temperature is critical Since rework involves local heating of a specific area of the PCB, the issue of temperature gradients can be even more severe For all of these reasons, it is strongly recommended that manufacturers perform studies to assess compatibility among the base material, the PCB fabrication process, and the assembly process First article qualifications when transitioning specific PCB designs to lead-free assembly are strongly recommended Success with one PCB design does not necessarily mean that other designs can use the same material or fabrication process successfully In short, leadfree assembly processes are significantly more demanding on the PCB and base materials used and require extensive engineering work to validate compatibility with the assembly process and the requirements for long-term reliability.. 11.3 SELECTING THE RIGHT BASE MATERIAL FOR SPECIFIC APPLICATIONS 2,3 birt code 39 How to Print Barcode Images on BIRT Reports - Aspose. BarCode for ...
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